RESEARCH TRAINING
Mr. Li Wei, M.Eng student under my supervision, received the inaugural prestige 2007 IEEE Electronic Device Society Maters Student Fellowship. The award is to promote, recognize and support graduate Masters level study and research within the areas of all aspect of engineering, physics, theory, experiment and simulation of electron and ion devices involving insulators, metals, organic materials, plasmas, semiconductors, quantum-effect materials, vacuum, and emerging materials. Only five awards will be given internationally per year. This year, besides Li Wei from NTU, the other awardees are from MIT, Georgia Tech, University of Central Florida and University of Bucharest in Romania.
Dr. Nagarajan Raghavan, who began his research in undergraduate level under my supervision, received 2011 IEEE EDS Ph.D Student fellowship, together with two others from University of London and University of California, Santa Barbara, CA, USA. He also was listed in the 2010 Trans. Of Electron Device Golden Reviewer list and 2012 Electron Device Lett Golden Reviewer list.
PUBLICATION STATISTICS (DETAIL PUBLICATION LIST IN APPENDIX)
| No. | Research Area | # of Journal Papers | # of Conference Papers | Total # of papers | # of Invited Talks | # of Tutorials | # of Keynote Speech |
|---|---|---|---|---|---|---|---|
|
1 |
Interconnect Reliability* |
46 |
46 |
91 |
15 |
2 |
3 |
|
2 |
Nanotechnology |
25 |
22 |
44 |
2 |
1 |
2 |
|
3 |
Devices Reliability |
16 |
11 |
27 |
5 |
1 |
2 |
|
4 |
Prognosis and Health Mgmt./ Predictive Maintenance |
7 |
13 |
20 |
9 |
|
1 |
|
5 |
Wafer Bonding |
7 |
12 |
19 |
1 |
|
|
|
6 |
Integrated Circuit Reliability |
7 |
6 |
13 |
5 |
1 |
|
|
7 |
Failure Analysis |
8 |
8 |
16 |
1 |
|
3 |
|
8 |
Reliability Statistics |
3 |
9 |
12 |
6 |
|
1 |
|
9 |
LED Reliability |
21 |
14 |
33 |
15 |
1 |
|
|
10 |
Quality |
2 |
6 |
8 |
3 |
|
|
|
11 |
Battery |
6 |
8 |
13 |
4 |
|
1 |
|
12 |
Remanufacturing |
1 |
1 |
2 |
|
|
|
|
13 |
Electromagnetics |
4 |
6 |
9 |
2 |
|
|
|
14 |
Radiation |
1 |
2 |
|
|
|
|
|
15 |
General Reliability |
|
2 |
2 |
|
2 |
|
|
16 |
Memory |
1 |
|
|
|
|
|
|
17 |
Others |
13 |
20 |
35 |
7 |
|
|
|
|
TOTAL |
168 |
186 |
344 |
75 |
8 |
20 |
*Interconnect includes ULSI Interconnects, TSV, Solders and wire bonding