C. M. Tan and Y. Hou. “Revisit to the finite element modeling of electromigration for narrow interconnects,” Journal of Applied Physics, vol. 102, no. 3, pp. 33705, 2007.
https://aip.scitation.org/doi/full/10.1063/1.2761434
C. M. Tan and Y. Hou. “Revisit to the finite element modeling of electromigration for narrow interconnects,” Journal of Applied Physics, vol. 102, no. 3, pp. 33705, 2007.
https://aip.scitation.org/doi/full/10.1063/1.2761434