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Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test CONFERENCE PAPERS Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test Read More »
Extending electromigration modeling from test structures to Integrated circuit layout level CONFERENCE PAPERS Extending electromigration modeling from test structures to Integrated circuit layout level Read More »
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Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling JOURNAL PAPERS Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling Read More »
Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief JOURNAL PAPERS Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief Read More »
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) CONFERENCE PAPERS Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) Read More »
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay CONFERENCE PAPERS Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay Read More »
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current CONFERENCE PAPERS TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current Read More »
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints JOURNAL PAPERS Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints Read More »