Y. D. Han*, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei, “Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints,” Journal of Electronic Materials, vol. 41, no. 9, pp. 2478-86, September, 2012
https://link.springer.com/article/10.1007/s11664-012-2142-2