HomePUBLICATIONCONFERENCE PAPERS3D circuit model for 3D IC reliability study (invited) 3D circuit model for 3D IC reliability study (invited)CONFERENCE PAPERS C. M. Tan and F. He. “3D circuit model for 3D IC reliability study (invited),” in EuroSIME, 2009. Share this: Click to share on Facebook (Opens in new window) Facebook Click to share on X (Opens in new window) X Related