F. He and C. M. Tan. “3D simulation-based research on the effect of interconnect structures on circuit reliability,” World Journal of Modelling and Simulation, vol. 8, no. 4, pp. 271-284, Nov. 2012.
https://dr.ntu.edu.sg/bitstream/10220/25292/1/3D%20simulation-based%20research%20on%20the%20effect%20of%20interconnect%20structures%20on%20circuit%20reliability.pdf