Y. D. Han, C. M. Tan and W. Jun. “A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress,” in IEEE Electronics Packaging Technology Conf., Singapore, 2008.
Y. D. Han, C. M. Tan and W. Jun. “A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress,” in IEEE Electronics Packaging Technology Conf., Singapore, 2008.