Circuit level interconnect reliability study using 3D circuit model JOURNAL PAPERS Circuit level interconnect reliability study using 3D circuit model Read More »
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model JOURNAL PAPERS Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model Read More »
Hot carrier reliability of power SOI EDNMOS JOURNAL PAPERS Hot carrier reliability of power SOI EDNMOS Read More »
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects JOURNAL PAPERS Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects Read More »
Addressing the challenges in solder resistance measurement for electromigration test JOURNAL PAPERS Addressing the challenges in solder resistance measurement for electromigration test Read More »
Electromigration performance of through silicon via (TSV) – A modeling approach JOURNAL PAPERS Electromigration performance of through silicon via (TSV) – A modeling approach Read More »
Analysis of humidity effects on the degradation of high-power white LEDs JOURNAL PAPERS Analysis of humidity effects on the degradation of high-power white LEDs Read More »
A framework to practical predictive maintenance modeling for multi-state systems JOURNAL PAPERS A framework to practical predictive maintenance modeling for multi-state systems Read More »
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI) JOURNAL PAPERS Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI) Read More »
