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Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects JOURNAL PAPERS Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects Read More »
Electromigration in width transition copper interconnect JOURNAL PAPERS Electromigration in width transition copper interconnect Read More »
Very high current density package level electromigration test for copper interconnects JOURNAL PAPERS Very high current density package level electromigration test for copper interconnects Read More »
A bimodal 3-parameter lognormal mixture distribution for electromigration failures JOURNAL PAPERS A bimodal 3-parameter lognormal mixture distribution for electromigration failures Read More »
Finite element modeling of capacitive coupling voltage contrast JOURNAL PAPERS Finite element modeling of capacitive coupling voltage contrast Read More »
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Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures JOURNAL PAPERS Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures Read More »
Aligned carbon nanotubes for through-wafer interconnects JOURNAL PAPERS Aligned carbon nanotubes for through-wafer interconnects Read More »
Room temperature observation of point defect on gold surface using thermovoltage mapping JOURNAL PAPERS Room temperature observation of point defect on gold surface using thermovoltage mapping Read More »
