Electromigration in ULSI Interconnects JOURNAL PAPERS Electromigration in ULSI Interconnects Read More »
Application of Gamma Distribution in Electromigration for Submicron Interconnects JOURNAL PAPERS Application of Gamma Distribution in Electromigration for Submicron Interconnects Read More »
Lifetime modeling for stress-induced voiding in integrated circuit interconnections JOURNAL PAPERS Lifetime modeling for stress-induced voiding in integrated circuit interconnections Read More »
Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab JOURNAL PAPERS Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab Read More »
Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling JOURNAL PAPERS Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling Read More »
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure JOURNAL PAPERS Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure Read More »
Feasibility study of the application of voltage contrast to printed circuit board JOURNAL PAPERS Feasibility study of the application of voltage contrast to printed circuit board Read More »
Low temperature sol-gel intermediate layer wafer bonding JOURNAL PAPERS Low temperature sol-gel intermediate layer wafer bonding Read More »
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding JOURNAL PAPERS Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding Read More »
