Z. W. Yang, D. H. Zhang, C. Y. Li, C. M. Tan, and K. Prasad. “Barrier layer effects on reliabilities of copper metallization,” Thin Solid Films, vol. 462-463, pp. 288, 2004
https://www.sciencedirect.com/science/article/pii/S0040609004006455
Z. W. Yang, D. H. Zhang, C. Y. Li, C. M. Tan, and K. Prasad. “Barrier layer effects on reliabilities of copper metallization,” Thin Solid Films, vol. 462-463, pp. 288, 2004
https://www.sciencedirect.com/science/article/pii/S0040609004006455