Y. Hou and C. M. Tan. “Blech effect in Cu interconnects with oxide and low-k dielectrics,” in Int. Symp. on physical and failure analysis of integrated circuits, 2007.
Y. Hou and C. M. Tan. “Blech effect in Cu interconnects with oxide and low-k dielectrics,” in Int. Symp. on physical and failure analysis of integrated circuits, 2007.