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Hot carrier reliability of power SOI EDNMOS JOURNAL PAPERS Hot carrier reliability of power SOI EDNMOS Read More »
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects JOURNAL PAPERS Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects Read More »
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Electromigration performance of through silicon via (TSV) – A modeling approach JOURNAL PAPERS Electromigration performance of through silicon via (TSV) – A modeling approach Read More »
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder JOURNAL PAPERS Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder Read More »
Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes CONFERENCE PAPERS Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes Read More »
Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes CONFERENCE PAPERS Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes Read More »