Aligned carbon nanotubes for through-wafer interconnects JOURNAL PAPERS Aligned carbon nanotubes for through-wafer interconnects Read More »
Room temperature observation of point defect on gold surface using thermovoltage mapping JOURNAL PAPERS Room temperature observation of point defect on gold surface using thermovoltage mapping Read More »
Electromigration in ULSI Interconnects JOURNAL PAPERS Electromigration in ULSI Interconnects Read More »
Application of Gamma Distribution in Electromigration for Submicron Interconnects JOURNAL PAPERS Application of Gamma Distribution in Electromigration for Submicron Interconnects Read More »
Lifetime modeling for stress-induced voiding in integrated circuit interconnections JOURNAL PAPERS Lifetime modeling for stress-induced voiding in integrated circuit interconnections Read More »
Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab JOURNAL PAPERS Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab Read More »
Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling JOURNAL PAPERS Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling Read More »
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure JOURNAL PAPERS Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure Read More »
Blech effect in Cu interconnects with oxide and low-k dielectrics CONFERENCE PAPERS Blech effect in Cu interconnects with oxide and low-k dielectrics Read More »