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An approach to statistical analysis of gate oxide breakdown mechanisms CONFERENCE PAPERS An approach to statistical analysis of gate oxide breakdown mechanisms Read More »
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Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding JOURNAL PAPERS Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding Read More »
Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification JOURNAL PAPERS Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification Read More »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect JOURNAL PAPERS Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Read More »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects JOURNAL PAPERS Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects Read More »
Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling CONFERENCE PAPERS Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling Read More »
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