Stress migration reliability of wide Cu interconnects with Gouging Vias CONFERENCE PAPERS Stress migration reliability of wide Cu interconnects with Gouging Vias Read More »
Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) CONFERENCE PAPERS Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) Read More »
Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure CONFERENCE PAPERS Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure Read More »
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects CONFERENCE PAPERS Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects Read More »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures CONFERENCE PAPERS Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures Read More »
Effect of medium vacuum on low temperature wafer bonding JOURNAL PAPERS Effect of medium vacuum on low temperature wafer bonding Read More »
Mechanism of sol-gel intermediate layer low temperature wafer bonding JOURNAL PAPERS Mechanism of sol-gel intermediate layer low temperature wafer bonding Read More »
Study of carbon in thermal oxide formed on 4H-SiC by XPS JOURNAL PAPERS Study of carbon in thermal oxide formed on 4H-SiC by XPS Read More »
Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc JOURNAL PAPERS Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc Read More »
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board CONFERENCE PAPERS Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board Read More »