Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc JOURNAL PAPERS Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc Read More »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology JOURNAL PAPERS Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology Read More »
Influence of applied load on vacuum wafer bonding at low temperature JOURNAL PAPERS Influence of applied load on vacuum wafer bonding at low temperature Read More »
Thermally induced stress in partial SOI structure during high temperature processing JOURNAL PAPERS Thermally induced stress in partial SOI structure during high temperature processing Read More »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects JOURNAL PAPERS Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects Read More »
Barrier layer effects on reliabilities of copper metallization JOURNAL PAPERS Barrier layer effects on reliabilities of copper metallization Read More »
Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing JOURNAL PAPERS Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing Read More »
Overcoming intrinsic weakness of ULSI metallization electromigration performances JOURNAL PAPERS Overcoming intrinsic weakness of ULSI metallization electromigration performances Read More »
Low temperature wafer bonding process using sol-gel intermediate layer CONFERENCE PAPERS Low temperature wafer bonding process using sol-gel intermediate layer Read More »
Current crowding effect on submicron copper dual damascene via bottom failure CONFERENCE PAPERS Current crowding effect on submicron copper dual damascene via bottom failure Read More »