JOURNAL PAPERS Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc Bya0938724577 February 25, 2004
JOURNAL PAPERS Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology Bya0938724577 February 25, 2004
JOURNAL PAPERS Influence of applied load on vacuum wafer bonding at low temperature Bya0938724577 February 25, 2004
JOURNAL PAPERS Thermally induced stress in partial SOI structure during high temperature processing Bya0938724577 February 25, 2004
JOURNAL PAPERS Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects Bya0938724577 February 25, 2004March 4, 2021
JOURNAL PAPERS Barrier layer effects on reliabilities of copper metallization Bya0938724577 February 25, 2004March 4, 2021
JOURNAL PAPERS Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing Bya0938724577 February 25, 2004March 4, 2021
JOURNAL PAPERS Overcoming intrinsic weakness of ULSI metallization electromigration performances Bya0938724577 February 25, 2004March 4, 2021
CONFERENCE PAPERS Low temperature wafer bonding process using sol-gel intermediate layer Byidiotj2002dm January 5, 2004
CONFERENCE PAPERS Current crowding effect on submicron copper dual damascene via bottom failure Byidiotj2002dm January 1, 2004