Current crowding effect on submicron copper dual damascene via bottom failure CONFERENCE PAPERS Current crowding effect on submicron copper dual damascene via bottom failure Read More »
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications CONFERENCE PAPERS Effect of current crowding on copper dual damascene via bottom failure for ULSI applications Read More »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology CONFERENCE PAPERS Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology Read More »
New useful information from simple forward I-V measurement of a power diode CONFERENCE PAPERS New useful information from simple forward I-V measurement of a power diode Read More »
Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer CONFERENCE PAPERS Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer Read More »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications CONFERENCE PAPERS Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications Read More »
Industry-university R&D collaboration: expectation and reality CONFERENCE PAPERS Industry-university R&D collaboration: expectation and reality Read More »
Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing CONFERENCE PAPERS Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing Read More »
Reliabiilty Analysis and Application with MATLAB (invited) CONFERENCE PAPERS Reliabiilty Analysis and Application with MATLAB (invited) Read More »
Low temperature wafer bonding in medium vacuum CONFERENCE PAPERS Low temperature wafer bonding in medium vacuum Read More »