Dehingia, A., Shabir, A., Tan, C. M., Gogoi, H. P., Das, U., & Roy, A. (2023). Compositionally engineered vacancy-ordered double-perovskite nanocrystals for photovoltaic application. Journal of Alloys and Compounds, 967, 171706.
Sahay, R., Tu, Y. C., Aziz, I., Budiman, A. S., Tan, C. M., Lee, P. S., … & Raghavan, N. (2023). Investigation of the reliability of nano-nickel/niobium oxide-based multilayer thin films deposited on polymer substrates for flexible electronic applications. Materials Advances, 4(15), 3257-3269.
Anurag Dehingia, Abdul Shabir, Ujjal Das, Karabi Kanchan Borgohain, Snigdha Patra, Pranab Kumar Sarkar, Cher Ming Tan, Asim Roy, “Alkali Metal Ion-Mediated Augmented Carrier Extraction in Iodobismuth Ternary Perovskite-Based Photovoltaic Device”, ACS Applied Electronic Materials Publication Date:April 18, 2023 https://doi.org/10.1021/acsaelm.3c00133
Jiali Wang, Hsiao-Chien Chen*, Hui-Ying Tan, Cher Ming Tan, Yanping Zhu, and Hao Ming Chen* Strong Correlation between the Dynamic Chemical State and Product Profile of Carbon Dioxide Electroreduction, ACS Applied Materials & Interfaces,14,22681-22696
Shuen-Lin Jeng, Cher Ming Tan, Ping-Chia Chen, “Statistical distribution of Lithium-ion batteries useful life and its application for battery pack reliability”, Journal of Energy Storage 51(2022)104399, 2022.03 doi:10.1016/j.est.2022.104399
Shabir, Abdul, and Cher Ming Tan. “Moisture dependent degradation rate of silicone in LED optical housing material–ab-initio modelling.” IEEE Transactions on Device and Materials Reliability (2022).
Tan, C. M., Chen, H. H., Wu, J. P., Sangwan, V., Tsai, K. Y., & Huang, W. C. (2022). Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System. Applied Sciences, 12(2), 640 do:10.3390/app12020640
Tan, Cher-Ming. “Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.” Applied Sciences 12.8 (2022): 4086 do:10.3390/app12084086
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Debesh Devadutta Mishra, Cherming Tan, Qishu Xu, Huihui Zhang & Guolong Tan Development of Cu-based ternary nanocrystalline chalcogenides using mechanical alloying and their characterization Journal of Materials Research volume 38, pages720–728 (2023) Accepted:22 November 2022
Adhikari, Aparna, Arijit Roy, and Cher Ming Tan. “Atomic drift-less electromigration model for submicron copper interconnects.” VOLUME 21 : ISSUE 7 (July) – 2022
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