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Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc JOURNAL PAPERS Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc Read More »
Thermal stability of Cu/α-Ta/SiO2/Si structures JOURNAL PAPERS Thermal stability of Cu/α-Ta/SiO2/Si structures Read More »
Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc JOURNAL PAPERS Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc Read More »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology JOURNAL PAPERS Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology Read More »
Influence of applied load on vacuum wafer bonding at low temperature JOURNAL PAPERS Influence of applied load on vacuum wafer bonding at low temperature Read More »
Thermally induced stress in partial SOI structure during high temperature processing JOURNAL PAPERS Thermally induced stress in partial SOI structure during high temperature processing Read More »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects JOURNAL PAPERS Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects Read More »
Barrier layer effects on reliabilities of copper metallization JOURNAL PAPERS Barrier layer effects on reliabilities of copper metallization Read More »
Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing JOURNAL PAPERS Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing Read More »