Lifetime modeling for stress-induced voiding in integrated circuit interconnections JOURNAL PAPERS Lifetime modeling for stress-induced voiding in integrated circuit interconnections Read More »
Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab JOURNAL PAPERS Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab Read More »
Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling JOURNAL PAPERS Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling Read More »
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure JOURNAL PAPERS Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure Read More »
Blech effect in Cu interconnects with oxide and low-k dielectrics CONFERENCE PAPERS Blech effect in Cu interconnects with oxide and low-k dielectrics Read More »
Electromigration in ULSI Interconnection (keynote) CONFERENCE PAPERS Electromigration in ULSI Interconnection (keynote) Read More »
Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab CONFERENCE PAPERS Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab Read More »
Revisit to the finite element modeling of electromigration for narrow interconnects JOURNAL PAPERS Revisit to the finite element modeling of electromigration for narrow interconnects Read More »
nhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab JOURNAL PAPERS nhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab Read More »
Reverse breakdown voltage measurement for power P+NN+ rectifier JOURNAL PAPERS Reverse breakdown voltage measurement for power P+NN+ rectifier Read More »