W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and G. Huang. “Effect of medium vacuum on low temperature wafer bonding,” Journal of Micromechanics and Microengineering, vol. 15, no. 5, pp. 1001, 2005.
W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and G. Huang. “Effect of medium vacuum on low temperature wafer bonding,” Journal of Micromechanics and Microengineering, vol. 15, no. 5, pp. 1001, 2005.