C. M. Tan, A. C. M. Lim, C. T. Y. Tai, G. Zhang, H. S. Park, and S. M. Ong. “Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test,” in JEDEX Conf., 2003.
C. M. Tan, A. C. M. Lim, C. T. Y. Tai, G. Zhang, H. S. Park, and S. M. Ong. “Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test,” in JEDEX Conf., 2003.