A. Roy, R. Kumar, C. M. Tan, T. Wong, and C. H. Tung. “Electromigration in damascene copper interconnects of line width down to 100 nm,” Semiconductor Science and Technology, vol. 21, pp. 1369, 2006.
A. Roy, R. Kumar, C. M. Tan, T. Wong, and C. H. Tung. “Electromigration in damascene copper interconnects of line width down to 100 nm,” Semiconductor Science and Technology, vol. 21, pp. 1369, 2006.