F. He and C. M. Tan. “Electromigration reliability of interconnections in RF low noise amplifier circuit,” Microelectronics Reliability, vol. 52, no. 2, pp. 446-454, Feb. 2012
https://www.sciencedirect.com/science/article/pii/S0026271411004513
F. He and C. M. Tan. “Electromigration reliability of interconnections in RF low noise amplifier circuit,” Microelectronics Reliability, vol. 52, no. 2, pp. 446-454, Feb. 2012
https://www.sciencedirect.com/science/article/pii/S0026271411004513