W. Li and C. M. Tan. “Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab,” Microelectronics Reliability, vol. 47, no. 9-11, pp. 1497-1501, 2007
https://www.sciencedirect.com/science/article/pii/S0026271407003186
W. Li and C. M. Tan. “Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab,” Microelectronics Reliability, vol. 47, no. 9-11, pp. 1497-1501, 2007
https://www.sciencedirect.com/science/article/pii/S0026271407003186