C. M. Tan and Z. Gan. “Failure mechanisms of aluminum bond pad peeling during thermosonic bonding,” IEEE Transactions on Device and Materials Reliability, vol. 3, no. 2, pp. 44-50, 2003
https://ieeexplore.ieee.org/abstract/document/1208285
C. M. Tan and Z. Gan. “Failure mechanisms of aluminum bond pad peeling during thermosonic bonding,” IEEE Transactions on Device and Materials Reliability, vol. 3, no. 2, pp. 44-50, 2003
https://ieeexplore.ieee.org/abstract/document/1208285