C. M. Tan and Y. Liu. “Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system,” Tutorial in IEEE Int. Electronic Packaging and Technology Conf., 2008.
C. M. Tan and Y. Liu. “Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system,” Tutorial in IEEE Int. Electronic Packaging and Technology Conf., 2008.