G. Huang, C. M. Tan, Z. Gan, G. Zhang, W. Yu, and W. Jun. “Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing,” in Int. Symp. on Physical and Failure Analysis of Integrated Circuits, 2004.
G. Huang, C. M. Tan, Z. Gan, G. Zhang, W. Yu, and W. Jun. “Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing,” in Int. Symp. on Physical and Failure Analysis of Integrated Circuits, 2004.