Interface fracture toughness assessment of solder joints using double cantilever beam test

S. Z. Y. Loo, P. C. Lee, Z. X. Lim, N. Yantara, T. Y. Tee, C. M. Tan, and Z. Chen., 2010, “Interface fracture toughness assessment of solder joints using double cantilever beam test,” International Journal of Modern Physics B, vol. 24, no. 1-2, pp. 164-174.

Scroll to Top