J. Wei, S. S. Deng, C. M. Tan, and C. K. Wong. “Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer,” in IEEE Electronics Packaging Technology Conf., Singapore, 2004.
J. Wei, S. S. Deng, C. M. Tan, and C. K. Wong. “Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer,” in IEEE Electronics Packaging Technology Conf., Singapore, 2004.