S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, H. Xie, and W. B. Yu. “Low temperature silicon wafer bonding by sol-gel processing,” in Int. Conf. on Materials for Advanced Technologies, 2003.
S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, H. Xie, and W. B. Yu. “Low temperature silicon wafer bonding by sol-gel processing,” in Int. Conf. on Materials for Advanced Technologies, 2003.