S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, and H. Xie. “Low temperature wafer bonding process using sol-gel intermediate layer,” in Int. Mechanical Engineering Congress and Exposition, 2004.
S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, and H. Xie. “Low temperature wafer bonding process using sol-gel intermediate layer,” in Int. Mechanical Engineering Congress and Exposition, 2004.