C. M. Tan, Y. X. Tay, C. W. Goh, and T. C. Chai. “Mapping of solder mask covered interconnects on high density printed circuit board,” in Electronic Packaging and Technology Conf., 2006.
C. M. Tan, Y. X. Tay, C. W. Goh, and T. C. Chai. “Mapping of solder mask covered interconnects on high density printed circuit board,” in Electronic Packaging and Technology Conf., 2006.