C. M. Tan, S. Deng, J. Wei, and W. B. Yu. “Mechanism of sol-gel intermediate layer low temperature wafer bonding,” Journal of Physics D-Applied Physics, vol. 38, no. 8, pp. 1308-1312, 2005.
C. M. Tan, S. Deng, J. Wei, and W. B. Yu. “Mechanism of sol-gel intermediate layer low temperature wafer bonding,” Journal of Physics D-Applied Physics, vol. 38, no. 8, pp. 1308-1312, 2005.