Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei, 2009, “Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes,” International Journal of Nanoscience, vol. 9, no. 4, pp. 283-287.
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei, 2009, “Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes,” International Journal of Nanoscience, vol. 9, no. 4, pp. 283-287.