Y. Hou and C. M. Tan. “Size effect in Cu nano-interconnects and its implication on electromigration,” presented at IEEE Int. Nanoelectronics Conf., Shanghai, China, Mar. 2008.
Y. Hou and C. M. Tan. “Size effect in Cu nano-interconnects and its implication on electromigration,” presented at IEEE Int. Nanoelectronics Conf., Shanghai, China, Mar. 2008.