Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure CONFERENCE PAPERS Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure Read More »
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects CONFERENCE PAPERS Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects Read More »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures CONFERENCE PAPERS Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures Read More »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects JOURNAL PAPERS Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects Read More »
Barrier layer effects on reliabilities of copper metallization JOURNAL PAPERS Barrier layer effects on reliabilities of copper metallization Read More »
Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing JOURNAL PAPERS Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing Read More »
Overcoming intrinsic weakness of ULSI metallization electromigration performances JOURNAL PAPERS Overcoming intrinsic weakness of ULSI metallization electromigration performances Read More »
Current crowding effect on submicron copper dual damascene via bottom failure CONFERENCE PAPERS Current crowding effect on submicron copper dual damascene via bottom failure Read More »
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications CONFERENCE PAPERS Effect of current crowding on copper dual damascene via bottom failure for ULSI applications Read More »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology CONFERENCE PAPERS Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology Read More »