Z. Gan and C. M. Tan. “Thermally induced stress in partial SOI structure during high temperature processing,” Microelectronic Engineering, vol. 71, no. 2, pp. 150-162, 2004
https://www.sciencedirect.com/science/article/pii/S016793170300529X
Z. Gan and C. M. Tan. “Thermally induced stress in partial SOI structure during high temperature processing,” Microelectronic Engineering, vol. 71, no. 2, pp. 150-162, 2004
https://www.sciencedirect.com/science/article/pii/S016793170300529X