Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification JOURNAL PAPERS Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification Read More »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect JOURNAL PAPERS Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Read More »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects JOURNAL PAPERS Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects Read More »
Investigation of weight-on-wheel switch failure in F-16 aircraft JOURNAL PAPERS Investigation of weight-on-wheel switch failure in F-16 aircraft Read More »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist JOURNAL PAPERS Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Read More »
Mathematical model for low-temperature wafer bonding under medium vacuum and its application JOURNAL PAPERS Mathematical model for low-temperature wafer bonding under medium vacuum and its application Read More »
Reliability screening through electrical testing for press-fit alternator power diode in automotive application JOURNAL PAPERS Reliability screening through electrical testing for press-fit alternator power diode in automotive application Read More »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications JOURNAL PAPERS Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications Read More »
Temperature dependence of the field emission of multiwalled carbon nanotubes JOURNAL PAPERS Temperature dependence of the field emission of multiwalled carbon nanotubes Read More »
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects JOURNAL PAPERS Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects Read More »
