New analysis technique for time to failure data in copper electromigration CONFERENCE PAPERS New analysis technique for time to failure data in copper electromigration Read More »
Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film CONFERENCE PAPERS Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film Read More »
Device temperature and stress distributions in power diode – a finite element method CONFERENCE PAPERS Device temperature and stress distributions in power diode – a finite element method Read More »
Reliability screening through electrical testing for press-fit alternator power diode in automotive application CONFERENCE PAPERS Reliability screening through electrical testing for press-fit alternator power diode in automotive application Read More »
Making wafer bonding viable for mass production CONFERENCE PAPERS Making wafer bonding viable for mass production Read More »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist CONFERENCE PAPERS Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Read More »
Determining maintenance strategy from root cause analysis and reliability data analysis (invited) CONFERENCE PAPERS Determining maintenance strategy from root cause analysis and reliability data analysis (invited) Read More »
Low temperature wafer bonding process using sol-gel intermediate layer CONFERENCE PAPERS Low temperature wafer bonding process using sol-gel intermediate layer Read More »
Current crowding effect on submicron copper dual damascene via bottom failure CONFERENCE PAPERS Current crowding effect on submicron copper dual damascene via bottom failure Read More »
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications CONFERENCE PAPERS Effect of current crowding on copper dual damascene via bottom failure for ULSI applications Read More »
