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Changing Reliability Physics of Interconnect from Micro- to Nanotechnology BOOKS CHAPTER Changing Reliability Physics of Interconnect from Micro- to Nanotechnology Read More »
Interface fracture toughness assessment of solder joints using double cantilever beam test JOURNAL PAPERS Interface fracture toughness assessment of solder joints using double cantilever beam test Read More »
Indentation size effect on the creep behavior of a SnAgCu solder JOURNAL PAPERS Indentation size effect on the creep behavior of a SnAgCu solder Read More »
Predictive maintenance model for multi-state systems with multiple failure modes and dependent element failure under imperfect maintenance CONFERENCE PAPERS Predictive maintenance model for multi-state systems with multiple failure modes and dependent element failure under imperfect maintenance Read More »
Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency CONFERENCE PAPERS Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency Read More »
Study of humidity reliability of high power LEDS (invited) CONFERENCE PAPERS Study of humidity reliability of high power LEDS (invited) Read More »
A possible reality on battery-less low-power portable electronics CONFERENCE PAPERS A possible reality on battery-less low-power portable electronics Read More »
Wireless energy harvesting using serially connected voltage doublers CONFERENCE PAPERS Wireless energy harvesting using serially connected voltage doublers Read More »
Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder CONFERENCE PAPERS Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder Read More »