Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature CONFERENCE PAPERS Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature Read More »
Examine the impact of maintenance policy for predictive maintenance CONFERENCE PAPERS Examine the impact of maintenance policy for predictive maintenance Read More »
New analysis technique for time to failure data in copper electromigration CONFERENCE PAPERS New analysis technique for time to failure data in copper electromigration Read More »
Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film CONFERENCE PAPERS Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film Read More »
Device temperature and stress distributions in power diode – a finite element method CONFERENCE PAPERS Device temperature and stress distributions in power diode – a finite element method Read More »
Reliability screening through electrical testing for press-fit alternator power diode in automotive application CONFERENCE PAPERS Reliability screening through electrical testing for press-fit alternator power diode in automotive application Read More »
Making wafer bonding viable for mass production CONFERENCE PAPERS Making wafer bonding viable for mass production Read More »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist CONFERENCE PAPERS Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Read More »
Determining maintenance strategy from root cause analysis and reliability data analysis (invited) CONFERENCE PAPERS Determining maintenance strategy from root cause analysis and reliability data analysis (invited) Read More »
Low temperature wafer bonding process using sol-gel intermediate layer CONFERENCE PAPERS Low temperature wafer bonding process using sol-gel intermediate layer Read More »