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Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects JOURNAL PAPERS Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects Read More »
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Interface fracture toughness assessment of solder joints using double cantilever beam test JOURNAL PAPERS Interface fracture toughness assessment of solder joints using double cantilever beam test Read More »
Indentation size effect on the creep behavior of a SnAgCu solder JOURNAL PAPERS Indentation size effect on the creep behavior of a SnAgCu solder Read More »
Analysis of humidity effects on the degradation of high-power white LEDs JOURNAL PAPERS Analysis of humidity effects on the degradation of high-power white LEDs Read More »
A framework to practical predictive maintenance modeling for multi-state systems JOURNAL PAPERS A framework to practical predictive maintenance modeling for multi-state systems Read More »
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI) JOURNAL PAPERS Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI) Read More »