Feasibility study of the application of voltage contrast to printed circuit board JOURNAL PAPERS Feasibility study of the application of voltage contrast to printed circuit board Read More »
Low temperature sol-gel intermediate layer wafer bonding JOURNAL PAPERS Low temperature sol-gel intermediate layer wafer bonding Read More »
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding JOURNAL PAPERS Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding Read More »
Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification JOURNAL PAPERS Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification Read More »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect JOURNAL PAPERS Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Read More »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects JOURNAL PAPERS Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects Read More »
Electromigration in damascene copper interconnects of line width down to 100 nm JOURNAL PAPERS Electromigration in damascene copper interconnects of line width down to 100 nm Read More »
Development of highly accelerated electromigration test JOURNAL PAPERS Development of highly accelerated electromigration test Read More »
Device level electrical-thermal-stress coupled-field modeling JOURNAL PAPERS Device level electrical-thermal-stress coupled-field modeling Read More »
Investigation of weight-on-wheel switch failure in F-16 aircraft JOURNAL PAPERS Investigation of weight-on-wheel switch failure in F-16 aircraft Read More »