Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects JOURNAL PAPERS Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects Read More »
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Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes CONFERENCE PAPERS Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes Read More »
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Changing Reliability Physics of Interconnect from Micro- to Nanotechnology BOOKS CHAPTER Changing Reliability Physics of Interconnect from Micro- to Nanotechnology Read More »
Interface fracture toughness assessment of solder joints using double cantilever beam test JOURNAL PAPERS Interface fracture toughness assessment of solder joints using double cantilever beam test Read More »
Indentation size effect on the creep behavior of a SnAgCu solder JOURNAL PAPERS Indentation size effect on the creep behavior of a SnAgCu solder Read More »
