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A bimodal 3-parameter lognormal mixture distribution for electromigration failures JOURNAL PAPERS A bimodal 3-parameter lognormal mixture distribution for electromigration failures Read More »
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system CONFERENCE PAPERS Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system Read More »
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature CONFERENCE PAPERS The multiple temperature heater platforms for solder Electromigration test conducted at room temperature Read More »
A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress CONFERENCE PAPERS A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress Read More »
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens CONFERENCE PAPERS Fracture Toughness Assessment of a solder joint using double cantilever beam specimens Read More »
Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing BOOKS CHAPTER Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing Read More »
Stress-induced voiding study in integrated circuit interconnects JOURNAL PAPERS Stress-induced voiding study in integrated circuit interconnects Read More »
Use of high altitude balloon platforms for small satellite testing CONFERENCE PAPERS Use of high altitude balloon platforms for small satellite testing Read More »
