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Device level electrical-thermal-stress coupled-field modeling CONFERENCE PAPERS Device level electrical-thermal-stress coupled-field modeling Read More »
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Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist JOURNAL PAPERS Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Read More »
Mathematical model for low-temperature wafer bonding under medium vacuum and its application JOURNAL PAPERS Mathematical model for low-temperature wafer bonding under medium vacuum and its application Read More »