Reliability screening through electrical testing for press-fit alternator power diode in automotive application JOURNAL PAPERS Reliability screening through electrical testing for press-fit alternator power diode in automotive application Read More »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications JOURNAL PAPERS Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications Read More »
Temperature dependence of the field emission of multiwalled carbon nanotubes JOURNAL PAPERS Temperature dependence of the field emission of multiwalled carbon nanotubes Read More »
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects JOURNAL PAPERS Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects Read More »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures JOURNAL PAPERS Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures Read More »
Current crowding effect on copper dual damascene via bottom failure for ULSI applications JOURNAL PAPERS Current crowding effect on copper dual damascene via bottom failure for ULSI applications Read More »
Stress migration reliability of wide Cu interconnects with Gouging Vias CONFERENCE PAPERS Stress migration reliability of wide Cu interconnects with Gouging Vias Read More »
Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) CONFERENCE PAPERS Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) Read More »
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Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects CONFERENCE PAPERS Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects Read More »