Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures CONFERENCE PAPERS Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures Read More »
Effect of medium vacuum on low temperature wafer bonding JOURNAL PAPERS Effect of medium vacuum on low temperature wafer bonding Read More »
Mechanism of sol-gel intermediate layer low temperature wafer bonding JOURNAL PAPERS Mechanism of sol-gel intermediate layer low temperature wafer bonding Read More »
Study of carbon in thermal oxide formed on 4H-SiC by XPS JOURNAL PAPERS Study of carbon in thermal oxide formed on 4H-SiC by XPS Read More »
Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc JOURNAL PAPERS Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc Read More »
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board CONFERENCE PAPERS Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board Read More »
Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature CONFERENCE PAPERS Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature Read More »
Examine the impact of maintenance policy for predictive maintenance CONFERENCE PAPERS Examine the impact of maintenance policy for predictive maintenance Read More »
New analysis technique for time to failure data in copper electromigration CONFERENCE PAPERS New analysis technique for time to failure data in copper electromigration Read More »
Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film CONFERENCE PAPERS Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film Read More »